Uploaded September 2025 | Updated September 2026, 2 hours ago

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ZEISS experts discuss the characterization of microstructures in electronic and semiconductor materials, highlighting the importance of advanced imaging techniques in this recent webinar.

0:00 Introduction
08:05 Intro to Microscopy for Industry
13:22 Intro to AI in Microscopy
16:46 Microscopy in the Circular Economy
24:24 SEM/EDS of Copper Adhesive Tape
26:12 SEM/EDS of Thermal Gap Filler
27:04 Polyimide Films
30:07 Multi-Scale Imaging with X-ray Microscopy (XRM)
32:07 XRM Thermal Gap Fillers Part 1
33:12  AI vs FDK Reconstruction for XRM
35:00 XRM Thermal Gap Fillers Part 2
35:57 XRM of Polyester Films
40:45 Copper Clad Laminate Characterization
44:52 Image Analysis of CCL with arivis Cloud
47:56 Al Reconstruction for CCL
50:51 XRM of Elastomer Gaskets
51:37 Particle Connectivity in Elastomer Gaskets
52:27 Pores within Pores of Ag-Cu Particles



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