Uploaded December 2020 | Updated September 2026, 26 minutes ago

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Watch this video and learn how to prepare TEM samples in back side geometry with ZEISS Crossbeam, your FIB-SEM for high throughput 3D analysis and sample preparation:

- Locate the region of interest (ROI) and protect it by an EBID and IBID
- chunk the sample and perform cutout and liftout
- Transfer the sample to a TEM grid and flip the grid from upright to horizontal position
- Pick up the sample again, rotate the grid 180 degrees and attach the sample to the TEM grid again. Flip the grid a second time, from horizontal to upright position.

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🔬 Learn more about ZEISS Crossbeam: zeiss.com/crossbeam
🔬 More about our microscopy solutions: zeiss.com/microscopy

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