Through hole DIP IC removal with Hakko 850 hot air rework station @ClayCowgill
Through hole DIP IC removal with Hakko 850 hot air rework station  @ClayCowgill
Uploaded November 2015 | Updated September 2026, 3 weeks ago
Hakko 850 hot air system used to remove DIP chips from a ~1987 era two-layer computer printed circuit board (Atari 130XE). You need to straighten the leads on the back if they're bent and multi-layer boards need more heat (or a heater from below as well as from above).
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Clay Cowgill |

Through hole DIP IC removal with Hakko 850 hot air rework station

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