The Problem with the 10 Degree C Rise Rule in PCB Design @AltiumAcademy
The Problem with the 10 Degree C Rise Rule in PCB Design  @AltiumAcademy
Uploaded March 2026 | Updated September 2026, 3 weeks ago
Altium Develop gives PCB engineers and their teams real-time visibility into design, supply chain, and manufacturing — so power budgeting decisions never happen in a vacuum: altium.com/develop?utm_source=youtube&utm_medium=video&utm_campaign=ontrack-podcast&utm_content=the-problem-with-the-10-degree-c-rise-rule-in-pcb-design

In this clip from the OnTrack Podcast, IPC 2152 author Mike Jouppi challenges one of PCB design's most widely accepted rules of thumb: the 10°C temperature rise guideline. Mike breaks down why this blanket criterion fails to account for the enormous variation between board types — from a tiny single-layer board to a massive 40-layer, 3×5 panel — and why treating them with the same thermal design target simply doesn't hold up under scrutiny.

Drawing on a comparison between IPC 2221 and IPC 2152, Mike makes the case for shifting the design mindset from temperature rise to power dissipation. By budgeting total conductor power losses across the entire board — including embedded resistors — engineers gain a far more accurate and actionable framework for thermal management.

👉 Watch the full interview here: youtu.be/xqTKbi-m_zw

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The Problem with the 10 Degree C Rise Rule in PCB Design

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