HDI PCB Stackup Breakdown - Etching Weight Via Spacing, & More @AltiumAcademy
HDI PCB Stackup Breakdown - Etching Weight Via Spacing, & More  @AltiumAcademy
Uploaded July 2026 | Updated September 2026, 3 weeks ago
Altium Develop connects your HDI stackup, via, and clearance decisions directly to your fabricator, so you catch manufacturability issues before they cost you a board: altium.com/develop?utm_source=youtube&utm_medium=video&utm_campaign=hdi-design&utm_content=hdi-pcb-stackup-breakdown-etching-weight-via-spacing-more

High-density interconnect (HDI) PCB design lives or dies by the stackup, and in this deep dive Zach Peterson reviews a real HDI audio-interface board to show where high-density layouts go wrong. You'll see how copper weight and etching drive minimum clearance values, why a sub-1-mil solder mask sliver gets your board kicked back by the manufacturer, and how board-edge clearance and copper pullback keep SMD pads from getting cut during routing. It's a practical walkthrough of the manufacturability checks every PCB designer should run before hitting order.

The heart of the video is via strategy: why overlapping mechanically drilled blind vias can't be manufactured, and how to rebuild the stackup with a buried via and microvias plus laser drilling to get the same routing flexibility on a manufacturable board. Zach also breaks down via aspect ratio limits, prepreg thickness, and closes with a grounding-strategy lesson on analog vs. digital ground splits, net ties, return current paths, and the radiated-emissions and EMI risks of splitting your planes. Whether you're tackling your first HDI design or tightening up your DFM process, these tips will help you design boards that pass fab review the first time.

πŸ‘‰ Design Review Inspiration: youtube.com/shorts/n0T8qnjzvyM?feature=share

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0:00 Intro
1:15 Audio Interface PCB
3:24 Manufacturer Feedback
5:35 Board Edge Clearance
6:42 Design Rule Setup
8:07 Clearance Value Impact
9:20 Manufacturability Risk ️
10:48 Adjust Copper Weights πŸͺ™
12:07 Blind Via Limitations
13:46 Redefine Via Structure
14:56 Core Layer Drilling
16:04 Blind Via Analysis
17:10 Grounding Strategy
18:30 Split Plane Issues ️
20:17 Susceptibility Test ️
21:43 Design Review Close
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HDI PCB Stackup Breakdown - Etching Weight Via Spacing, & More

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