Uploaded July 2026 | Updated September 2026, 2 weeks ago
What does it actually mean for connectivity IP to stop being a supporting function — and become the layer that determines whether a 3D IC delivers on its promise?
In this Season 3 premiere of the Siemens 3D IC Podcast, new host Tova Levy speaks with Archana Cheruliyil, Principal Product Marketing Manager at Alphawave Semi, a Qualcomm company, about what it really takes to develop IP for 3D ICs — and why connectivity has shifted from a background function to a system-defining one. Alphawave Semi's portfolio spans UCIe die-to-die interconnect, HBM memory interfaces, PCIe, CXL, and custom silicon, all optimized for the disaggregated architectures that 3D IC design demands.
What you’ll learn...
(02:45) Archana's background: semiconductor IP, high-speed clocking, and AI memory subsystems
(03:49) Alphawave Semi's role in 3D IC — and why the interconnect layer is now foundational
(05:40) 3D IC integration headaches: signal integrity, power delivery, and thermal hotspots
(07:59) IP development for 3D ICs: co-optimizing with packaging, interposers, and photonics
(10:02) Friction points: methodology inertia, ecosystem immaturity, and standardization vs. customization
(12:26) Balancing performance, reliability, and manufacturability — and Alphawave Semi's validation approach
(14:51) The magic wand pick: open chiplet interoperability and solving thermal constraints
(17:27) What's accelerating now: UCIe adoption, cross-chain collaboration, photonics, and advanced packaging
Ideal for: 3D IC architects, silicon IP designers, advanced packaging engineers, chiplet ecosystem participants, EDA users, and anyone navigating the shift from monolithic SoC design to heterogeneous, disaggregated integration.
Connect with Tova Levy
LinkedIn- https://sie.ag/4cAPeZ
Connect with Archana P Cheruliyil
LinkedIn- https://sie.ag/4H69LB
Alphawave’s website- https://sie.ag/27jfbW
▶️ Listen and subscribe:
» Spotify: https://sie.ag/4atxsQ
» Apple: https://sie.ag/sFoHY
» Siemens Podcast Network: https://sie.ag/qs4R1
▶️ Connect with us:
LinkedIn: https://sie.ag/6SR3Kp
» Blog: https://sie.ag/3QhZcR
» IC Packaging Community Discussion Board: https://sie.ag/Er5xk
» X: https://sie.ag/6PuwqJ
#3DIC #Semiconductor #ElectricalEngineering #Engineering #ICdesign #SemiconductorElectronics
What does it actually mean for connectivity IP to stop being a supporting function — and become the layer that determines whether a 3D IC delivers on its promise?
In this Season 3 premiere of the Siemens 3D IC Podcast, new host Tova Levy speaks with Archana Cheruliyil, Principal Product Marketing Manager at Alphawave Semi, a Qualcomm company, about what it really takes to develop IP for 3D ICs — and why connectivity has shifted from a background function to a system-defining one. Alphawave Semi's portfolio spans UCIe die-to-die interconnect, HBM memory interfaces, PCIe, CXL, and custom silicon, all optimized for the disaggregated architectures that 3D IC design demands.
What you’ll learn...
(02:45) Archana's background: semiconductor IP, high-speed clocking, and AI memory subsystems
(03:49) Alphawave Semi's role in 3D IC — and why the interconnect layer is now foundational
(05:40) 3D IC integration headaches: signal integrity, power delivery, and thermal hotspots
(07:59) IP development for 3D ICs: co-optimizing with packaging, interposers, and photonics
(10:02) Friction points: methodology inertia, ecosystem immaturity, and standardization vs. customization
(12:26) Balancing performance, reliability, and manufacturability — and Alphawave Semi's validation approach
(14:51) The magic wand pick: open chiplet interoperability and solving thermal constraints
(17:27) What's accelerating now: UCIe adoption, cross-chain collaboration, photonics, and advanced packaging
Ideal for: 3D IC architects, silicon IP designers, advanced packaging engineers, chiplet ecosystem participants, EDA users, and anyone navigating the shift from monolithic SoC design to heterogeneous, disaggregated integration.
Connect with Tova Levy
LinkedIn- https://sie.ag/4cAPeZ
Connect with Archana P Cheruliyil
LinkedIn- https://sie.ag/4H69LB
Alphawave’s website- https://sie.ag/27jfbW
▶️ Listen and subscribe:
» Spotify: https://sie.ag/4atxsQ
» Apple: https://sie.ag/sFoHY
» Siemens Podcast Network: https://sie.ag/qs4R1
▶️ Connect with us:
LinkedIn: https://sie.ag/6SR3Kp
» Blog: https://sie.ag/3QhZcR
» IC Packaging Community Discussion Board: https://sie.ag/Er5xk
» X: https://sie.ag/6PuwqJ
#3DIC #Semiconductor #ElectricalEngineering #Engineering #ICdesign #SemiconductorElectronics
