Uploaded June 2026 | Updated September 2026, 2 weeks ago
This video explains how semiconductor manufacturers can overcome the growing disconnect between chip design and factory execution by creating a unified digital thread. It highlights how Siemens connects design data (Bill of Information), manufacturing processes (Bill of Processes), and factory equipment capabilities (Bill of Equipment) to ensure design intent flows seamlessly from engineering to production. By bridging the gap between Semiconductor Lifecycle Management and Manufacturing Execution Systems, manufacturers can reduce yield loss, accelerate time-to-market, improve traceability and IP security, and achieve more reliable, efficient semiconductor production in an increasingly complex industry.
Learn more on https://sie.ag/2ojyRE
This video explains how semiconductor manufacturers can overcome the growing disconnect between chip design and factory execution by creating a unified digital thread. It highlights how Siemens connects design data (Bill of Information), manufacturing processes (Bill of Processes), and factory equipment capabilities (Bill of Equipment) to ensure design intent flows seamlessly from engineering to production. By bridging the gap between Semiconductor Lifecycle Management and Manufacturing Execution Systems, manufacturers can reduce yield loss, accelerate time-to-market, improve traceability and IP security, and achieve more reliable, efficient semiconductor production in an increasingly complex industry.
Learn more on https://sie.ag/2ojyRE
