How To Test Printed Circuit Board Assembly with a Flexible Sensor @Micro-Measurements

Uploaded March 2022 | Updated September 2026, 2 hours ago

In this Video , Darryl talks about cracks in the PCBs and shows how Micro-Measurements G1350A strain gage sensor is used when testing components, sub-assemblies, printed circuit boards, Ball Grid Array (BGA) surface mount packaging and finished products.

Who should use foil strain gage sensors: Test-fixture vendors, Component suppliers, Contract manufacturers (EMS), PCB assemblers.
Main problems: PCB failure due of over-flexure during various assembly and test processes, minor cracks and last but not least field returns.

C5K Series 3-Element Rosette Gages:
micro-measurements.com/rectangular-rosette-patterns

Micro-Measurements: micro-measurements.com
Advanced Sensors Technology: micro-measurements.com/advanced-sensors-technology

How To Test Printed Circuit Board Assembly with a Flexible Sensor

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$Small-Scale Sensor Designed For PCB Reliability Testing. Cracks in the PCBs — brittle fractures in solder and even across components, particularly around BGAs — can be induced by in-circuit test fixtures and during assembly, burn-in and testing, system integration, and packaging and shipping. The new Advanced Sensors Technology C4A-XX-G1350A-120 rectangular rosette gage is designed to detect PCB surface strains at critical locations in consumer electronics. C4A-XX-G1350A is miniature-scale strain gage (gauge) sensor designed to meet the growing demand for precise, stable, and reliable stress analysis of PCBs, even in harsh environments. Strain measurements should be made after all design iterations of the PCB, including changes to on-board components, which may alter thermal stress loading. This is especially useful when introducing new solder materials and processes, which may have a different stiffness and introduce a different soldering thermal profile. The miniaturization of consumer electronics — and consequent increase in component density — results in larger thermal stresses, new requirements for surviving repeated loadings, and a greater need for impact stress survival. Meeting these specifications requires accurate knowledge of strains in the PCB and on-board components. Strain gage measurement is the quickest, most accurate, and most cost-effective method for identifying strains on a PCB, and can be used in developing loading fixtures and test plans to optimize the testing phase. The solution is miniature-scale strain gage (gauge) sensor designed to meet the growing demand for precise, stable, and reliable stress analysis of PCBs, even in harsh environments. Micro-Measurements: https://micro-measurements.com/ Advanced Sensors Technology: https://micro-measurements.com/advanced-sensors-technology StrainTalks™ seminar: https://straintalks.com/ StrainBond™? https://micro-measurements.com/bonding StrainBlog: https://www.strainblog.com/$

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