Uploaded February 2021 | Updated September 2026, 27 minutes ago
Cracks in the PCBs — brittle fractures in solder and even across components, particularly around BGAs — can be induced by in-circuit test fixtures and during assembly, burn-in and testing, system integration, and packaging and shipping.
The new Advanced Sensors Technology C4A-XX-G1350A-120 rectangular rosette gage is designed to detect PCB surface strains at critical locations in consumer electronics.
C4A-XX-G1350A is miniature-scale strain gage (gauge) sensor designed to meet the growing demand for precise, stable, and reliable stress analysis of PCBs, even in harsh environments.
Strain measurements should be made after all design iterations of the PCB, including changes to on-board components, which may alter thermal stress loading. This is especially useful when introducing new solder materials and processes, which may have a different stiffness and introduce a different soldering thermal profile.
The miniaturization of consumer electronics — and consequent increase in component density — results in larger thermal stresses, new requirements for surviving repeated loadings, and a greater need for impact stress survival. Meeting these specifications requires accurate knowledge of strains in the PCB and on-board components. Strain gage measurement is the quickest, most accurate, and most cost-effective method for identifying strains on a PCB, and can be used in developing loading fixtures and test plans to optimize the testing phase.
The solution is miniature-scale strain gage (gauge) sensor designed to meet the growing demand for precise, stable, and reliable stress analysis of PCBs, even in harsh environments.
Micro-Measurements: micro-measurements.com
Advanced Sensors Technology: micro-measurements.com/advanced-sensors-technology
StrainTalks™ seminar: straintalks.com
StrainBond™? micro-measurements.com/bonding
StrainBlog: strainblog.com
Cracks in the PCBs — brittle fractures in solder and even across components, particularly around BGAs — can be induced by in-circuit test fixtures and during assembly, burn-in and testing, system integration, and packaging and shipping.
The new Advanced Sensors Technology C4A-XX-G1350A-120 rectangular rosette gage is designed to detect PCB surface strains at critical locations in consumer electronics.
C4A-XX-G1350A is miniature-scale strain gage (gauge) sensor designed to meet the growing demand for precise, stable, and reliable stress analysis of PCBs, even in harsh environments.
Strain measurements should be made after all design iterations of the PCB, including changes to on-board components, which may alter thermal stress loading. This is especially useful when introducing new solder materials and processes, which may have a different stiffness and introduce a different soldering thermal profile.
The miniaturization of consumer electronics — and consequent increase in component density — results in larger thermal stresses, new requirements for surviving repeated loadings, and a greater need for impact stress survival. Meeting these specifications requires accurate knowledge of strains in the PCB and on-board components. Strain gage measurement is the quickest, most accurate, and most cost-effective method for identifying strains on a PCB, and can be used in developing loading fixtures and test plans to optimize the testing phase.
The solution is miniature-scale strain gage (gauge) sensor designed to meet the growing demand for precise, stable, and reliable stress analysis of PCBs, even in harsh environments.
Micro-Measurements: micro-measurements.com
Advanced Sensors Technology: micro-measurements.com/advanced-sensors-technology
StrainTalks™ seminar: straintalks.com
StrainBond™? micro-measurements.com/bonding
StrainBlog: strainblog.com
