Uploaded August 2026 | Updated September 2026, 2 weeks ago
What can AI actually do in 3D IC design today — and what’s still science fiction?
In this episode of the Siemens 3D IC Podcast, host Tova Levy speaks with Sudarshan Deo, Software Engineering Manager for 3D IC at Siemens, about what AI can — and can’t — actually do in 3D IC design today, and why the hype rarely matches the reality on the ground.
Connect with Sudarshan Deo
LinkedIn https://sie.ag/4RXcDS
Connect with Tova Levy
LinkedIn https://sie.ag/sQ1tW
▶️ Listen and subscribe:
» Spotify: https://sie.ag/2H1mnE
» Apple: https://sie.ag/3g7VXN
» Siemens Podcast Network: https://sie.ag/2bNJhE
▶️ Connect with us:
LinkedIn: https://sie.ag/6cmQZN
» Blog: https://sie.ag/teWpb
» IC Packaging Community Discussion Board: https://sie.ag/3kQkmN
» X: https://sie.ag/4xJjNL
#3DIC #Semiconductor #ElectricalEngineering #Engineering #ICdesign #SemiconductorElectronics #SemiconductorPackaging
What can AI actually do in 3D IC design today — and what’s still science fiction?
In this episode of the Siemens 3D IC Podcast, host Tova Levy speaks with Sudarshan Deo, Software Engineering Manager for 3D IC at Siemens, about what AI can — and can’t — actually do in 3D IC design today, and why the hype rarely matches the reality on the ground.
Connect with Sudarshan Deo
LinkedIn https://sie.ag/4RXcDS
Connect with Tova Levy
LinkedIn https://sie.ag/sQ1tW
▶️ Listen and subscribe:
» Spotify: https://sie.ag/2H1mnE
» Apple: https://sie.ag/3g7VXN
» Siemens Podcast Network: https://sie.ag/2bNJhE
▶️ Connect with us:
LinkedIn: https://sie.ag/6cmQZN
» Blog: https://sie.ag/teWpb
» IC Packaging Community Discussion Board: https://sie.ag/3kQkmN
» X: https://sie.ag/4xJjNL
#3DIC #Semiconductor #ElectricalEngineering #Engineering #ICdesign #SemiconductorElectronics #SemiconductorPackaging










