Uploaded May 2026 | Updated September 2026, 3 weeks ago
Designing 3D interconnects and chiplet packages often requires architecture decisions before layout is fully defined. But traditional workflows can push signal integrity insight too late, when redesigns are expensive and simulation bottlenecks slow down decision-making.
In this video, We introduce Keysight 3D Interconnect Designer, a fast and accurate way to design, evaluate, and explore 3D interconnect behavior before layout.
You will see how 3D Interconnect Designer helps engineers:
• Explore interconnect architectures earlier in the design cycle
• Use built-in UCIe and BoW bump map templates
• Define custom bump maps for advanced package and chiplet designs
• Compare multi-substrate design variations
• Build connectivity using a net-based workflow
• Model bumps, vias, breakout routing, and hatched ground planes
• Use Python automation to reduce setup time and scale design exploration
• Analyze full interconnect links without relying on full 3D FEM simulation for every iteration
• Gain system-level confidence earlier in the design process
3D Interconnect Designer is designed for advanced packaging, chiplet, 2.5D/3DIC, silicon bridge, silicon interposer, PCB, and flex PCB workflows. It supports early architecture exploration before package layout, UCIe and BoW die-to-die interface evaluation, complex interconnect trade-off analysis, and hatched or waffle ground plane modeling.
Instead of waiting until late-stage validation, engineers can explore, decide, and validate earlier—helping reduce late-stage risk, improve design iteration speed, and move forward with system-level confidence.
Download 3D Interconnect Designer today to make architecture decisions earlier and accelerate your 3D interconnect design process.
keysight.com/find/3d-interconnect-designer
Designing 3D interconnects and chiplet packages often requires architecture decisions before layout is fully defined. But traditional workflows can push signal integrity insight too late, when redesigns are expensive and simulation bottlenecks slow down decision-making.
In this video, We introduce Keysight 3D Interconnect Designer, a fast and accurate way to design, evaluate, and explore 3D interconnect behavior before layout.
You will see how 3D Interconnect Designer helps engineers:
• Explore interconnect architectures earlier in the design cycle
• Use built-in UCIe and BoW bump map templates
• Define custom bump maps for advanced package and chiplet designs
• Compare multi-substrate design variations
• Build connectivity using a net-based workflow
• Model bumps, vias, breakout routing, and hatched ground planes
• Use Python automation to reduce setup time and scale design exploration
• Analyze full interconnect links without relying on full 3D FEM simulation for every iteration
• Gain system-level confidence earlier in the design process
3D Interconnect Designer is designed for advanced packaging, chiplet, 2.5D/3DIC, silicon bridge, silicon interposer, PCB, and flex PCB workflows. It supports early architecture exploration before package layout, UCIe and BoW die-to-die interface evaluation, complex interconnect trade-off analysis, and hatched or waffle ground plane modeling.
Instead of waiting until late-stage validation, engineers can explore, decide, and validate earlier—helping reduce late-stage risk, improve design iteration speed, and move forward with system-level confidence.
Download 3D Interconnect Designer today to make architecture decisions earlier and accelerate your 3D interconnect design process.
keysight.com/find/3d-interconnect-designer
