Uploaded August 2026 | Updated September 2026, 3 hours ago
Discover how advanced UV laser technology enables high-precision processing for semiconductor manufacturing, from wafer processing and PCB depaneling to FPC processing and precision marking of semiconductor components.
In this video, Laserax showcases a range of UV laser applications designed for demanding semiconductor and advanced electronics manufacturing processes, delivering precision, repeatability, traceability, and controlled material processing.
0:00 Wafer Laser Applications
- UV Laser Marking for Wafer Traceability – Permanent, high-contrast identification for reliable wafer tracking and traceability throughout semiconductor manufacturing.
- UV Laser Micro-Texturing – Precise surface structuring and controlled material modification for advanced wafer applications.
- UV Laser Scribing – Controlled laser scribing for wafer dicing preparation, enabling precise and efficient downstream separation.
- UV Laser Cleaning – Non-contact removal of residues and contaminants from wafer surfaces for precise surface preparation.
1:19 PCB Laser Applications
- UV Laser Depaneling – High-precision, non-contact separation of individual Printed Circuit Boards (PCB) from production panels. UV laser processing helps minimize mechanical stress and thermal impact while enabling clean, precise cuts.
- PCB Laser Marking & Processing – Permanent identification and controlled material processing for traceability and advanced electronics manufacturing.
1:57 FPC Laser Applications
- UV Laser Marking for Flexible Printed Circuits (FPC) – Permanent identification and traceability on sensitive flexible circuit materials.
- UV Laser Cleaning – Precise, localized removal of residues and contaminants from FPC surfaces while minimizing impact on the underlying material.
2:13 Semiconductor Component Laser Marking
- Lead Frame Laser Marking – Permanent, high-contrast identification for semiconductor lead frames, supporting reliable part identification and traceability.
- Crystal Resonator Laser Marking – Precision marking for crystal resonators and sensitive electronic components requiring controlled and repeatable processing.
- UV Laser Annealed Marking – Controlled surface marking that produces high-contrast identification with minimal material removal.
- UV Laser Micromachining & Engraving – Precise material removal for fine features, detailed markings, and controlled engraving applications.
UV Laser Processing for Semiconductor Manufacturing
Semiconductor manufacturing requires high precision, repeatability, traceability, and process control. UV laser technology provides a non-contact processing method for delicate and sensitive materials, helping minimize mechanical stress and thermal impact while enabling highly localized processing.
The short wavelength of UV lasers enables fine feature sizes, precise energy delivery, and controlled material interaction, making UV laser technology well suited for advanced wafer, PCB, FPC, and semiconductor component applications.
Laserax develops advanced laser solutions for semiconductor and electronics manufacturing, supporting applications including wafer marking, micro-texturing, scribing, cleaning, PCB depaneling, FPC processing, component marking, and precision micromachining.
Learn more about Laserax semiconductor laser solutions:
laserax.com/semiconductors
Contact a Laserax expert:
laserax.com/ask-expert
Discover how advanced UV laser technology enables high-precision processing for semiconductor manufacturing, from wafer processing and PCB depaneling to FPC processing and precision marking of semiconductor components.
In this video, Laserax showcases a range of UV laser applications designed for demanding semiconductor and advanced electronics manufacturing processes, delivering precision, repeatability, traceability, and controlled material processing.
0:00 Wafer Laser Applications
- UV Laser Marking for Wafer Traceability – Permanent, high-contrast identification for reliable wafer tracking and traceability throughout semiconductor manufacturing.
- UV Laser Micro-Texturing – Precise surface structuring and controlled material modification for advanced wafer applications.
- UV Laser Scribing – Controlled laser scribing for wafer dicing preparation, enabling precise and efficient downstream separation.
- UV Laser Cleaning – Non-contact removal of residues and contaminants from wafer surfaces for precise surface preparation.
1:19 PCB Laser Applications
- UV Laser Depaneling – High-precision, non-contact separation of individual Printed Circuit Boards (PCB) from production panels. UV laser processing helps minimize mechanical stress and thermal impact while enabling clean, precise cuts.
- PCB Laser Marking & Processing – Permanent identification and controlled material processing for traceability and advanced electronics manufacturing.
1:57 FPC Laser Applications
- UV Laser Marking for Flexible Printed Circuits (FPC) – Permanent identification and traceability on sensitive flexible circuit materials.
- UV Laser Cleaning – Precise, localized removal of residues and contaminants from FPC surfaces while minimizing impact on the underlying material.
2:13 Semiconductor Component Laser Marking
- Lead Frame Laser Marking – Permanent, high-contrast identification for semiconductor lead frames, supporting reliable part identification and traceability.
- Crystal Resonator Laser Marking – Precision marking for crystal resonators and sensitive electronic components requiring controlled and repeatable processing.
- UV Laser Annealed Marking – Controlled surface marking that produces high-contrast identification with minimal material removal.
- UV Laser Micromachining & Engraving – Precise material removal for fine features, detailed markings, and controlled engraving applications.
UV Laser Processing for Semiconductor Manufacturing
Semiconductor manufacturing requires high precision, repeatability, traceability, and process control. UV laser technology provides a non-contact processing method for delicate and sensitive materials, helping minimize mechanical stress and thermal impact while enabling highly localized processing.
The short wavelength of UV lasers enables fine feature sizes, precise energy delivery, and controlled material interaction, making UV laser technology well suited for advanced wafer, PCB, FPC, and semiconductor component applications.
Laserax develops advanced laser solutions for semiconductor and electronics manufacturing, supporting applications including wafer marking, micro-texturing, scribing, cleaning, PCB depaneling, FPC processing, component marking, and precision micromachining.
Learn more about Laserax semiconductor laser solutions:
laserax.com/semiconductors
Contact a Laserax expert:
laserax.com/ask-expert
