Charbax | Paper: Highly Flexible InP-Based Quantum Dot Light Emitting Diodes by Seoul National University @charbax | Uploaded May 2024 | Updated October 2024, 1 week ago.
The research conducted by a team at Seoul National University focuses on improving the performance and durability of Quantum Dot Light Emitting Diodes (QLEDs) using a highly flexible indium phosphide (InP)-based structure. Led by a researcher from the A1 lab, the study addresses the issue of thermal degradation, which is a significant challenge in flexible electronic devices due to their lower thermal conductivity compared to traditional rigid substrates. The specific innovation lies in using a micrometer-thick flexible substrate with an aluminum layer to enhance thermal management.
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Thanks to Synaptics for being my Display Week 2024 video coverage sponsor. Check out all my videos with Synaptics in my playlist: youtube.com/watch?v=3eyDBxYKBGA&list=PL7xXqJFxvYvhAbQoe9YN4c84SqXxIY3fQ&index=2
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The key problem with the traditional flexible PN substrates is their low thermal conductivity, measured at 0.19, which leads to thermal degradation of the quantum dots. This degradation occurs because higher operating temperatures can be induced when the device is bent or flexed, causing a decrease in performance and a shorter lifespan. The research aimed to overcome this limitation by introducing an aluminum layer on the PN substrate to improve its thermal conductivity.
By simulating the thermal behavior and fabricating the QLED with this new configuration, the researchers observed an improvement in the device's performance. Specifically, they noted an increase in the operating voltage from seven volts to eight volts. This increase indicates better thermal management and efficiency in the QLED operation. The improved thermal conductivity from the aluminum layer helps dissipate heat more effectively, reducing the risk of thermal degradation.
The entire process of developing this enhanced QLED took about a week. The planning phase lasted approximately three days, during which the team conceptualized the approach and designed the experiments. Following this, it took two days to prepare the necessary materials. The actual fabrication of the device was completed in one day, showcasing the efficiency of their process. After fabrication, the team spent additional time analyzing and validating the performance improvements.
One of the significant advantages of this innovation is its potential to offer a more affordable and durable solution for flexible QLEDs. Traditional QLEDs often use glass substrates, which, while effective in thermal management, are not flexible and add to the cost and weight of the devices. By using a plastic substrate enhanced with an aluminum layer, the researchers created a device that is not only flexible and lightweight but also stable under high temperatures, ensuring a longer operational life.
To further validate their findings, the researchers compared the performance of the new aluminum-coated flexible substrate with the conventional PN film substrate. The comparison showed a marked improvement in the device's lifetime and stability when using the aluminum-enhanced substrate. This result underscores the potential for this technology to be used in various applications where flexible, durable, and efficient light-emitting devices are required.
The study represents a significant step forward in the development of flexible electronics, particularly in the realm of QLEDs. By addressing the critical issue of thermal degradation through innovative substrate design, the researchers have paved the way for more reliable and longer-lasting flexible displays and lighting solutions. This advancement could have broad implications for industries ranging from consumer electronics to wearable technology and beyond.
In conclusion, the research by Seoul National University demonstrates a promising approach to enhancing the performance and durability of flexible QLEDs. Through the use of an aluminum layer on a flexible substrate, the team successfully improved thermal management, leading to better efficiency and a longer lifespan for the devices. This innovation holds potential for creating more affordable and durable flexible electronic devices, highlighting the importance of continued research and development in this field.
Watch all my videos from the Display Week 2024 here: youtube.com/playlist?list=PL7xXqJFxvYvjJihFUMIabPjjPrALb6a7Z
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The research conducted by a team at Seoul National University focuses on improving the performance and durability of Quantum Dot Light Emitting Diodes (QLEDs) using a highly flexible indium phosphide (InP)-based structure. Led by a researcher from the A1 lab, the study addresses the issue of thermal degradation, which is a significant challenge in flexible electronic devices due to their lower thermal conductivity compared to traditional rigid substrates. The specific innovation lies in using a micrometer-thick flexible substrate with an aluminum layer to enhance thermal management.
----
Thanks to Synaptics for being my Display Week 2024 video coverage sponsor. Check out all my videos with Synaptics in my playlist: youtube.com/watch?v=3eyDBxYKBGA&list=PL7xXqJFxvYvhAbQoe9YN4c84SqXxIY3fQ&index=2
----
The key problem with the traditional flexible PN substrates is their low thermal conductivity, measured at 0.19, which leads to thermal degradation of the quantum dots. This degradation occurs because higher operating temperatures can be induced when the device is bent or flexed, causing a decrease in performance and a shorter lifespan. The research aimed to overcome this limitation by introducing an aluminum layer on the PN substrate to improve its thermal conductivity.
By simulating the thermal behavior and fabricating the QLED with this new configuration, the researchers observed an improvement in the device's performance. Specifically, they noted an increase in the operating voltage from seven volts to eight volts. This increase indicates better thermal management and efficiency in the QLED operation. The improved thermal conductivity from the aluminum layer helps dissipate heat more effectively, reducing the risk of thermal degradation.
The entire process of developing this enhanced QLED took about a week. The planning phase lasted approximately three days, during which the team conceptualized the approach and designed the experiments. Following this, it took two days to prepare the necessary materials. The actual fabrication of the device was completed in one day, showcasing the efficiency of their process. After fabrication, the team spent additional time analyzing and validating the performance improvements.
One of the significant advantages of this innovation is its potential to offer a more affordable and durable solution for flexible QLEDs. Traditional QLEDs often use glass substrates, which, while effective in thermal management, are not flexible and add to the cost and weight of the devices. By using a plastic substrate enhanced with an aluminum layer, the researchers created a device that is not only flexible and lightweight but also stable under high temperatures, ensuring a longer operational life.
To further validate their findings, the researchers compared the performance of the new aluminum-coated flexible substrate with the conventional PN film substrate. The comparison showed a marked improvement in the device's lifetime and stability when using the aluminum-enhanced substrate. This result underscores the potential for this technology to be used in various applications where flexible, durable, and efficient light-emitting devices are required.
The study represents a significant step forward in the development of flexible electronics, particularly in the realm of QLEDs. By addressing the critical issue of thermal degradation through innovative substrate design, the researchers have paved the way for more reliable and longer-lasting flexible displays and lighting solutions. This advancement could have broad implications for industries ranging from consumer electronics to wearable technology and beyond.
In conclusion, the research by Seoul National University demonstrates a promising approach to enhancing the performance and durability of flexible QLEDs. Through the use of an aluminum layer on a flexible substrate, the team successfully improved thermal management, leading to better efficiency and a longer lifespan for the devices. This innovation holds potential for creating more affordable and durable flexible electronic devices, highlighting the importance of continued research and development in this field.
Watch all my videos from the Display Week 2024 here: youtube.com/playlist?list=PL7xXqJFxvYvjJihFUMIabPjjPrALb6a7Z
Description by Chatgpt.
This video was filmed using the DJI Pocket 3 ($669 at amzn.to/4aMpKIC ), watch all my DJI Pocket 3 videos here youtube.com/playlist?list=PL7xXqJFxvYvhDlWIAxm_pR9dp7ArSkhKK
My Early Access Members get full access to all my videos as I upload them nightly youtube.com/charbax/join before they are published are the rate of 3-5 videos per day in the days following the event.
![Fraunhofer IIS embeddif.[ai] Worlds Smallest AI at Embedded World 2024 #ew24](https://i.ytimg.com/vi/eSjFRkrNlOQ/hqdefault.jpg "Fraunhofer IIS embeddif.[ai] Worlds Smallest AI at Embedded World 2024 #ew24
The embedded world of 2024 showcases a groundbreaking development with the unveiling of the worlds smallest AI unit, brought to life by Fraunhofer IISs embeddif.ai. The event features an impressive presentation by Maximilian Kasper, who delves into the unique capabilities of this tiny AI solution. The star of the show is a compact computing unit capable of running complex AI models, demonstrating a new level of embedded artificial intelligence.
The small computing unit is based on an ARM Cortex M7 processor, a well-known architecture for embedded systems, usually seen in microcontrollers. This AI units impressive feature is its ability to run an AI model called Tiny YOLO, designed for real-time object detection. Kasper demonstrates how this small AI system can detect and identify people using a camera connected to the unit. Despite its tiny size, the system manages to process images at nearly 5 frames per second, with a resolution of 128x128 pixels, showcasing its high efficiency.
Another significant aspect of this AI unit is its efficient use of embedded C code, optimized for the Cortex M7. This allows the system to fully utilize the processors capabilities, ensuring maximum performance. Alongside this demonstration, different setups showcase varied applications of the technology. One demo illustrates on-device training, where the same hardware setup can classify images of animals. The AI can detect a cow or a dog, displaying its predictions on a small screen. This adaptability opens up a range of possibilities for edge computing applications, where AI can operate without the need for a central server.
The flexibility to train on-device is one of the most innovative aspects of this tiny AI system. This is particularly useful for applications where a central server isnt feasible or real-time training is required. Kasper explains that the training data is supplied through a small SD card, which contains the ground truth information for several images. The on-device training uses backpropagation and stochastic gradient descent, all processed directly within the AI unit. This capability to perform training on the device distinguishes this technology from other AI solutions that require pre-trained models deployed from external sources.
Despite its size, the AI units power requirements are relatively high, which is expected given the complex computations involved in training and running AI models. During the event, Kasper demonstrated an untrained model, which often misclassified objects, showing that proper training is essential for accurate predictions. This underlines the importance of reliable training data and efficient learning algorithms for successful AI deployment in embedded systems.
In summary, the worlds smallest AI unit by Fraunhofer IIS at Embedded World 2024 introduces a new realm of possibilities for embedded AI. With its compact design, powerful ARM Cortex M7 processor, and ability to run and train AI models on-device, this technology has the potential to revolutionize embedded applications. Its use of embedded C code, optimized for the processor, ensures high performance and efficiency, while the capacity to train on-device offers flexibility in various scenarios. The potential applications are vast, from smart sensors to real-time object detection, marking a significant leap in embedded AI technology.
Watch all my videos from the Embedded World 2024 here: https://www.youtube.com/playlist?list=PL7xXqJFxvYvjgUpdNMBkGzEWU6YVxR8Ga
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