Uploaded December 2022 | Updated September 2026, 3 weeks ago

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Session 2, Hot Chips 34 (2022), Monday, August 22, 2022.

Passage: A Wafer-Scale, Programmable Photonic Communication Substrate
Nicholas Harris, Lightmatter

Heterogenous Integration Enables FPGA Based Hardware Acceleration for RF Applications
Sergey Shumarayev & Tim Hoang, Intel

Enabling scalable application-specific optical engines (ASOE) by monolithic integration of photonics and electronics
Christoph Schulien, Ranovus

Scaling of Memory Performance and Capacity with CXL Memory Expander
Sung Joo Park, Samsung