HC33-K3: Architectural Challenges: AI Chips, Decision Support, and High Performance Computing @hotchipsvideos
HC33-K3: Architectural Challenges: AI Chips, Decision Support, and High Performance Computing  @hotchipsvideos
Uploaded December 2021 | Updated September 2026, 3 weeks ago
Keynote 3, Hot Chips 33 (2021), Tuesday, August 24, 2021

Dimitri Kusnezov, Deputy Under Secretary for AI and Technology, Department of Energy

In our final keynote, Dimitri describes how the DoE interacts with the computer industry in order to perform its widely varied jobs, such as ensuring the safety of America’s nuclear stockpile through complex simulations on supercomputers.
HC33-K3: Architectural Challenges: AI Chips, Decision Support, and High Performance ComputingHC2024-S4: AI Processors Part 2HC30-S1: Mobile/Power Efficient ProcessorsHC2025-T2.2: AI Kernel Programming (part 2)HC26-S1: High Performance ComputingHC18-PS: Who Owns the Living Room?HC27-S2: Multimedia and Signal ProcessingHC20-T2: Scalable Parallel Programming with CUDAHC2025-S1: CPUsHC28-S6: Emerging EmbeddedHC29-S2: IOT/EmbeddedHC29-S5: FPGAs
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HC33-K3: Architectural Challenges: AI Chips, Decision Support, and High Performance Computing

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