Uploaded December 2023 | Updated September 2026, 3 weeks ago
Hot Chips 2023, Tuesday, August 29, 2023.
TrustForge: A Cryptographically Secure Enclave for Azure and AWS
Todd Austin, Valeria Bertacco and Alex Kisil; Agita Labs
An Open-Source 130-nm Fusion-Enabled Deconvolution Kernel Generator IC For Real-Time mmWave Radar Platform Motion Compensation
Nikhil Poole, Priyanka Raina and Amin Arbabian; Stanford University
A Scalable Multi-Chiplet Deep Learning Accelerator with Hub-Side 2.5D Heterogeneous Integration
Zhanhong Tan, Yifu Wu, Yannian Zhang, Haobing Shi, Wuke Zhang and Kaisheng Ma; Tsinghua University
PHEP: Paillier Homomorphic Encryption Processors for Privacy-Preserving Applications in Cloud Computing
Guiming Shi, Yi Li, Xueqiang Wang, Zhanhong Tan, Dapeng Cao, Jingwei Cai, Yuchen Wei, Zehua Li, Wuke Zhang, Yifu Wu, Wei Xu and Kaisheng Ma; Tsinghua University
HyperAccel LPU: Accelerating Hyperscale Models for Generative AI
Seungjae Moon, Junsoo Kim, Jung-Hoon Kim, Junseo Cha, Gyubin Choi, Seongmin Hong and Joo-Young Kim; HyperAccel / KAIST
An Abstract of SiMa.ai’s MLSoC Architecture
Srivi Dhruvanarayan; SiMa.ai
Shaheen: An Open, Secure, and Scalable RV64 SoC for Autonomous Nano-UAVs
Luca Valente, Asif Hussain Chiralil Veeran, Mattia Sinigaglia, Yvan Tortorella, Alessandro Nadalini, Nils Wistoff, Bruno Sà, Angelo Garofalo, Rafail Psiakis, Mohammed Tolba, Ari Kulmala, Nimisha Limaye, Ozgur Sinanoglu, Sandro Pinto, Daniele Palossi, Luca Benini, Baker Mohammad and Davide Rossi; University of Bologna
A Heterogeneous SoC for Bluetooth LE in 28nm
Felicia Guo, Nayiri Krzysztofowicz, Alex Moreno, Jeffrey Ni, Daniel Lovell, Yufeng Chi, Kareem Ahmad, Sherwin Afshar, Josh Alexander, Dylan Brater, Cheng Cao, Daniel Fan, Ryan Lund, Jackson Paddock, Griffin Prechter, Troy Sheldon, Shreesha Sreedhara, Anson Tsai, Eric Wu, Kerry Yu, Daniel Fritchman, Aviral Pandey, Ali Niknejad, Kristofer Pister and Borivoje Nikolic; University of California Berkeley
Driving Compute Scale-out Performance with Optical I/O Chiplets in Advanced System-in-Package Platforms
Mark Wade, Chen Sun, Matt Sysak, Vladimir Stojanović, Pooya Tadayon, Ravi Mahajan and Babak Sabi; Ayar Labs
A Heterogeneous RISC-V SoC for ML Applications in Intel 16 Technology
Yufeng Chi, Franklin Huang, Raghav Gupta, Ella Schwarz, Jennifer Zhou, Reza Sajadiany, Animesh Agrawal, Max Banister, Michelle Boulos, Jason Chandran, Jessica Dowdall, Leena Elzeiny, Claire Gantan, Anthony Han, Roger Hsiao, Chadwick Leung, Edwin Lim, Jose Rodriguez, Tushar Sondhi, Mitchell Twu, Rongyi Wang, Mike Xiao, Ruohan Yan, Paul Kwon, Zhaokai Liu, Jerry Zhao, Bob Zhou, Ali Niknejad, Kristofer Pister and Borivoje Nikolić; University of California, Berkeley
Hot Chips 2023, Tuesday, August 29, 2023.
TrustForge: A Cryptographically Secure Enclave for Azure and AWS
Todd Austin, Valeria Bertacco and Alex Kisil; Agita Labs
An Open-Source 130-nm Fusion-Enabled Deconvolution Kernel Generator IC For Real-Time mmWave Radar Platform Motion Compensation
Nikhil Poole, Priyanka Raina and Amin Arbabian; Stanford University
A Scalable Multi-Chiplet Deep Learning Accelerator with Hub-Side 2.5D Heterogeneous Integration
Zhanhong Tan, Yifu Wu, Yannian Zhang, Haobing Shi, Wuke Zhang and Kaisheng Ma; Tsinghua University
PHEP: Paillier Homomorphic Encryption Processors for Privacy-Preserving Applications in Cloud Computing
Guiming Shi, Yi Li, Xueqiang Wang, Zhanhong Tan, Dapeng Cao, Jingwei Cai, Yuchen Wei, Zehua Li, Wuke Zhang, Yifu Wu, Wei Xu and Kaisheng Ma; Tsinghua University
HyperAccel LPU: Accelerating Hyperscale Models for Generative AI
Seungjae Moon, Junsoo Kim, Jung-Hoon Kim, Junseo Cha, Gyubin Choi, Seongmin Hong and Joo-Young Kim; HyperAccel / KAIST
An Abstract of SiMa.ai’s MLSoC Architecture
Srivi Dhruvanarayan; SiMa.ai
Shaheen: An Open, Secure, and Scalable RV64 SoC for Autonomous Nano-UAVs
Luca Valente, Asif Hussain Chiralil Veeran, Mattia Sinigaglia, Yvan Tortorella, Alessandro Nadalini, Nils Wistoff, Bruno Sà, Angelo Garofalo, Rafail Psiakis, Mohammed Tolba, Ari Kulmala, Nimisha Limaye, Ozgur Sinanoglu, Sandro Pinto, Daniele Palossi, Luca Benini, Baker Mohammad and Davide Rossi; University of Bologna
A Heterogeneous SoC for Bluetooth LE in 28nm
Felicia Guo, Nayiri Krzysztofowicz, Alex Moreno, Jeffrey Ni, Daniel Lovell, Yufeng Chi, Kareem Ahmad, Sherwin Afshar, Josh Alexander, Dylan Brater, Cheng Cao, Daniel Fan, Ryan Lund, Jackson Paddock, Griffin Prechter, Troy Sheldon, Shreesha Sreedhara, Anson Tsai, Eric Wu, Kerry Yu, Daniel Fritchman, Aviral Pandey, Ali Niknejad, Kristofer Pister and Borivoje Nikolic; University of California Berkeley
Driving Compute Scale-out Performance with Optical I/O Chiplets in Advanced System-in-Package Platforms
Mark Wade, Chen Sun, Matt Sysak, Vladimir Stojanović, Pooya Tadayon, Ravi Mahajan and Babak Sabi; Ayar Labs
A Heterogeneous RISC-V SoC for ML Applications in Intel 16 Technology
Yufeng Chi, Franklin Huang, Raghav Gupta, Ella Schwarz, Jennifer Zhou, Reza Sajadiany, Animesh Agrawal, Max Banister, Michelle Boulos, Jason Chandran, Jessica Dowdall, Leena Elzeiny, Claire Gantan, Anthony Han, Roger Hsiao, Chadwick Leung, Edwin Lim, Jose Rodriguez, Tushar Sondhi, Mitchell Twu, Rongyi Wang, Mike Xiao, Ruohan Yan, Paul Kwon, Zhaokai Liu, Jerry Zhao, Bob Zhou, Ali Niknejad, Kristofer Pister and Borivoje Nikolić; University of California, Berkeley
