From Tapeouts to Products: Why Open-Source Silicon Must Solve Real Problems to Survive (M. Kassem) @FOSSiFoundation
From Tapeouts to Products: Why Open-Source Silicon Must Solve Real Problems to Survive (M. Kassem)  @FOSSiFoundation
Uploaded May 2026 | Updated September 2026, 2 weeks ago
Open-source silicon reaching real products is the moment the ecosystem matures from a research tool into infrastructure — the same transition Linux made when it started running production servers. Products impose the constraints that drive quality: a battery life target forces low- power verification, a temperature spec forces worst-case timing closure, a BOM cost goal forces die area discipline. These are the rigors that transform open IP blocks from tapeout artifacts into components the industry can trust, and that open custom silicon to the thousands of product companies that have never had access to it. The open-source stack is ready for this — open PDKs, automated RTL-to-GDSII, a proven SoC harness, and shared-wafer shuttles that make silicon accessible. The tools are no longer the barrier. The next step is ours to take.​​​​​​​​​​​​​​​​
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From Tapeouts to Products: Why Open-Source Silicon Must Solve Real Problems to Survive (M. Kassem)

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