ESP32-S3 Design Deep Dive: Power, RF, and Layout Best Practices @AltiumAcademy
ESP32-S3 Design Deep Dive: Power, RF, and Layout Best Practices  @AltiumAcademy
Uploaded January 2026 | Updated September 2026, 2 weeks ago
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Join Zach Peterson for an in-depth design review of a custom ESP32-S3 PCB. This four-layer board features the ESP32-S3 microcontroller chip rather than the typical module, incorporating a lipo battery charging system, USB-C with data line protection, NCP voltage regulators, and a ceramic chip antenna with impedance matching network.

Watch as Zach analyzes the schematic organization, evaluates the RF layout decisions, examines power distribution strategies, and discusses best practices for hand soldering small components like 0402 passives.

Learn about ground plane management beneath chip antennas, via placement strategies for thermal pads, paste mask segmentation for QFN packages, and how to balance component spacing for hand soldering versus reflow assembly.

πŸ‘‰ Resources from this video:
- ISO 14443 NFC Reader Project With ESP32: resources.altium.com/p/iso-14443-nfc-reader-project-esp32
- Routing Requirements for a USB Interface on a 2-Layer PCB: resources.altium.com/p/routing-requirements-usb-20-2-layer-pcb
- Hassan's LinkedIn: linkedin.com/in/hassan-mansour-2367a9351

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0:00 Intro
0:34 Hassan's original design overview & goals
1:57 Schematic walkthrough
4:12 Hand soldering tiny 0402 components
4:47 PCB layout review: layer stackup & ground planes
6:41 Transmission line routing, impedance & hole sizes
9:34 NCP Regulator
10:35 You don't need four layers...
11:52 Chip antenna layout & ground plane cutout analysis
13:53 Paste mask segmentation for the ESP32 thermal pad
15:11 - Final results
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ESP32-S3 Design Deep Dive: Power, RF, and Layout Best Practices

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