Uploaded March 2026 | Updated September 2026, 2 weeks ago
Learn more about BZPACK mSiC® Power Modules, Microchip’s family of HV-H3TRB-proven, pin-compatible, press-fit silicon carbide power modules designed to simplify high-power system development. In this quick video, we highlight five key reasons engineers are choosing BZPACK mSiC® modules for next-generation power conversion and electrification systems:
1️⃣ HV-H3TRB proven reliability
Engineered to exceed HV-H3TRB requirements, with demonstrated operation beyond 3000+ hours to ensure long-term reliability in high-humidity, high-voltage and high-temperature environments.
2️⃣ Pin compatibility and standard footprints
Built on industry-standard, pin-compatible footprints that reduce redesign effort and enable easier integration with multi-sourced module ecosystems.
3️⃣ Press-fit, solderless assembly
Press-fit terminals eliminate soldering, simplifying manufacturing, improving assembly consistency and accelerating production. Optional pre-applied Thermal Interface Material (TIM) further streamlines system assembly.
4️⃣ Thermal and performance tuning
Available with Aluminum Oxide (Al₂O₃) or Aluminum Nitride (AlN) substrates, allowing designers to optimize for cost or thermal performance while maintaining stable RDS(on) over temperature.
5️⃣ Topology flexibility
Multiple topology options support a wide range of power conversion architectures, helping design teams scale systems and move from prototype to production with fewer design iterations.
👉 Learn more and download resources: microchip.com/bzpack
Learn more about BZPACK mSiC® Power Modules, Microchip’s family of HV-H3TRB-proven, pin-compatible, press-fit silicon carbide power modules designed to simplify high-power system development. In this quick video, we highlight five key reasons engineers are choosing BZPACK mSiC® modules for next-generation power conversion and electrification systems:
1️⃣ HV-H3TRB proven reliability
Engineered to exceed HV-H3TRB requirements, with demonstrated operation beyond 3000+ hours to ensure long-term reliability in high-humidity, high-voltage and high-temperature environments.
2️⃣ Pin compatibility and standard footprints
Built on industry-standard, pin-compatible footprints that reduce redesign effort and enable easier integration with multi-sourced module ecosystems.
3️⃣ Press-fit, solderless assembly
Press-fit terminals eliminate soldering, simplifying manufacturing, improving assembly consistency and accelerating production. Optional pre-applied Thermal Interface Material (TIM) further streamlines system assembly.
4️⃣ Thermal and performance tuning
Available with Aluminum Oxide (Al₂O₃) or Aluminum Nitride (AlN) substrates, allowing designers to optimize for cost or thermal performance while maintaining stable RDS(on) over temperature.
5️⃣ Topology flexibility
Multiple topology options support a wide range of power conversion architectures, helping design teams scale systems and move from prototype to production with fewer design iterations.
👉 Learn more and download resources: microchip.com/bzpack
