DARPAtv | 2023 ERI Summit: Security in the Face of Microelectronics Supply Chain (Panel) @DARPAtv | Uploaded September 2023 | Updated October 2024, 3 days ago.
Security in the Face of Microelectronics Supply Chain Panel: “Security Challenges After Integration” featuring panelists, Ms. Cheri Caddy, Deputy Assistant National Cyber Director for Cyber Technology, R&D, Office of the National Cyber Director, Dr. Kevin Fu, Professor of Electrical and Computer Engineering, Computer Sciences, and Bioengineering, Northeastern University and KRI Kostas Research Institute for Homeland Security, and Mr. Jason Williams, Co-Founder and Chief Executive Officer, Cromulence, LLC, alongside panel moderator, Dr. Lok Yan, DARPA MTO Program Manager.
Security in the Face of Microelectronics Supply Chain Panel: “Security Challenges After Integration” featuring panelists, Ms. Cheri Caddy, Deputy Assistant National Cyber Director for Cyber Technology, R&D, Office of the National Cyber Director, Dr. Kevin Fu, Professor of Electrical and Computer Engineering, Computer Sciences, and Bioengineering, Northeastern University and KRI Kostas Research Institute for Homeland Security, and Mr. Jason Williams, Co-Founder and Chief Executive Officer, Cromulence, LLC, alongside panel moderator, Dr. Lok Yan, DARPA MTO Program Manager.
