@DARPAtv
@DARPAtv
DARPAtv | 2023 ERI Summit: 3D IC EDA: What is Needed, and How/When Can We Deliver? (Lee) @DARPAtv | Uploaded September 2023 | Updated October 2024, 2 days ago.
Mr. Timothy Lee, Boeing Technical Fellow, presents "3DHI for Aerospace and Defense Applications: State-of-the-Art Edge Computing and High-Bandwidth Communications."
2023 ERI Summit: 3D IC EDA: What is Needed, and How/When Can We Deliver? (Lee)FAARM - Fuel Access Anywhere, Regardless of Means - Advanced Research Concept Opportunity2023 ERI Summit: 3D IC EDA: What is Needed, and How/When Can We Deliver? (Tang)Extreme Environment ElectronicsDARPA Program Managers2023 ERI Summit: (Meet Us At) The Intersection of Mission and Commerce (Friedman)2023 ERI Summit: 3D IC EDA: What is Needed, and How/When Can We Deliver? (Patwardhan)Quantum Computing2023 ERI Summit: Connecting Technology to Future System Needs (Chang-Chien)Next-Generation Wide-Bandgap Semiconductor DevicesReal or Not: Defending Authenticity in a Digital World - SXSW Panel2023 ERI Summit: International Supply Chain (Carter)

2023 ERI Summit: 3D IC EDA: What is Needed, and How/When Can We Deliver? (Lee) @DARPAtv

SHARE TO X SHARE TO REDDIT SHARE TO FACEBOOK WALLPAPER