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DARPAtv | 2023 ERI Summit: 3D IC EDA: What is Needed, and How/When Can We Deliver? (Tang) @DARPAtv | Uploaded September 2023 | Updated October 2024, 2 days ago.
Dr. Elaine Tang, Siemens' Senior Key Expert, presents "Latest Results and Upcoming Challenges in Simulation of 3D ICs."
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2023 ERI Summit: 3D IC EDA: What is Needed, and How/When Can We Deliver? (Tang) @DARPAtv

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