Purdue University Mechanical Engineering | Tiwei Wei: Semiconductor Packaging, Heat Transfer, and Assembly @PurdueME | Uploaded March 2023 | Updated October 2024, 9 hours ago.
Website: alphalab-purdue.org
Alpha Lab (All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab) focuses on advanced semiconductor interconnects and packaging manufacturing techniques development, including novel packaging materials, innovative manufacturing processes, design and integration, as well as advanced thermal management techniques, such as smart-controlled microjet cooling, cryogenic cooling, and efficient thermal packaging materials. The research field covers high-performance computations, 3DIC, Light-emitting diodes, power electronics, photonics, quantum computing, X-ray, and high-power laser optics. Research is conducted at Birck Nanotechnology Center, one of the largest academic cleanrooms in the world.
Email: tiwei@purdue.edu
Website: alphalab-purdue.org
Purdue Mechanical Engineering: https://purdue.edu/ME
Website: alphalab-purdue.org
Alpha Lab (All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab) focuses on advanced semiconductor interconnects and packaging manufacturing techniques development, including novel packaging materials, innovative manufacturing processes, design and integration, as well as advanced thermal management techniques, such as smart-controlled microjet cooling, cryogenic cooling, and efficient thermal packaging materials. The research field covers high-performance computations, 3DIC, Light-emitting diodes, power electronics, photonics, quantum computing, X-ray, and high-power laser optics. Research is conducted at Birck Nanotechnology Center, one of the largest academic cleanrooms in the world.
Email: tiwei@purdue.edu
Website: alphalab-purdue.org
Purdue Mechanical Engineering: https://purdue.edu/ME
