Uploaded January 2026 | Updated September 2026, 1 week ago

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When chips shrink, heat becomes the limiting factor

IBM Research shared new results from DARPA’s Thermonat project, introducing atom-accurate thermal modeling for next-generation semiconductors. With 0.002% prediction accuracy and speeds 50,000× faster than current tools, Thermonat helps designers better account for heat as chips keep shrinking.

Dive into the blog for more → ibm.co/60438LiXL

#thermonat #machinelearning #ai #semiconductors