Uploaded July 2026 | Updated September 2026, 2 weeks ago

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What does it take to build a chip when the chip itself is an ecosystem — and the wire connecting everything has become the biggest bottleneck in modern semiconductors?
In this episode of the Siemens 3D IC Podcast, host Tova Levy speaks with Bob Patti, President and CEO of NHanced Semiconductors, about what it takes to build and scale advanced packaging — and why the wire, not the transistor, has become the defining challenge of modern chip design.

Connect with Bob Patti:
LinkedIn https://sie.ag/3LVnY7

Connect with Tova Levy:
LinkedIn https://sie.ag/MxBnX

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