Uploaded December 2025 | Updated September 2026, 2 weeks ago
scitechdaily.com/new-paper-thin-brain-implant-could-transform-how-humans-connect-with-ai
Researchers at Columbia University, working in a team including Stanford University and the University of Pennsylvania, have developed a wireless, high-bandwidth channel-count brain-computer interface (BCI) platform, called the Biological Interface System to Cortex, or BISC, that promises to dramatically expand the capabilities of human–machine interaction and neuro-therapeutics.
The entire implant is a single complementary metal-oxide-semiconductor (CMOS) integrated circuit chip thinned to a total thickness of only 50 um rendering it mechanically flexible. The resulting micro-electrocorticography (µECoG) device integrates 65,536 electrodes, 1024 recording channels, and 16,384 stimulation channels. The device consumes a volume of less than 2 mm³, allowing it to sit directly on the surface of the brain, under the skull. By leveraging the large-scale manufacturing techniques developed in the semiconductor industry, these implants can be easily manufactured at-scale.
Credit: Jane Nisselson
scitechdaily.com/new-paper-thin-brain-implant-could-transform-how-humans-connect-with-ai
Researchers at Columbia University, working in a team including Stanford University and the University of Pennsylvania, have developed a wireless, high-bandwidth channel-count brain-computer interface (BCI) platform, called the Biological Interface System to Cortex, or BISC, that promises to dramatically expand the capabilities of human–machine interaction and neuro-therapeutics.
The entire implant is a single complementary metal-oxide-semiconductor (CMOS) integrated circuit chip thinned to a total thickness of only 50 um rendering it mechanically flexible. The resulting micro-electrocorticography (µECoG) device integrates 65,536 electrodes, 1024 recording channels, and 16,384 stimulation channels. The device consumes a volume of less than 2 mm³, allowing it to sit directly on the surface of the brain, under the skull. By leveraging the large-scale manufacturing techniques developed in the semiconductor industry, these implants can be easily manufactured at-scale.
Credit: Jane Nisselson
