Uploaded November 2025 | Updated September 2026, 2 weeks ago
The bandwidth and capacity demand explosion of AI are forcing interconnects and storage to rapidly adapt and evolve. Pushing the bandwidth challenges the limits of the copper interconnect. The SNIA SFF Technical Working Group is proactively addressing the bandwidth needs through new development work on 448G channel modeling and PCIe 7.0 projects as well as studying mechanical aspects of the system design. In addition, there is a focus on how to meet the capacity and performance needs of storage for AI through a new EDSFF form factor. Come ask our panel of experts questions to help better understand what is being done now to push these limits.
Learn about the challenges of the 448G interconnect and what the SFF TWG is doing to solve it.. Learn about the challenges of the PCIe 7.0 interconnect and what the SFF TWG is doing to solve it. Learn about what we are doing with form factors to meet future usages.
Presented by Anthony Constantine, Micron Technology, Mike Allison, Samsung and John Geldman, KIOXIA
The bandwidth and capacity demand explosion of AI are forcing interconnects and storage to rapidly adapt and evolve. Pushing the bandwidth challenges the limits of the copper interconnect. The SNIA SFF Technical Working Group is proactively addressing the bandwidth needs through new development work on 448G channel modeling and PCIe 7.0 projects as well as studying mechanical aspects of the system design. In addition, there is a focus on how to meet the capacity and performance needs of storage for AI through a new EDSFF form factor. Come ask our panel of experts questions to help better understand what is being done now to push these limits.
Learn about the challenges of the 448G interconnect and what the SFF TWG is doing to solve it.. Learn about the challenges of the PCIe 7.0 interconnect and what the SFF TWG is doing to solve it. Learn about what we are doing with form factors to meet future usages.
Presented by Anthony Constantine, Micron Technology, Mike Allison, Samsung and John Geldman, KIOXIA
