Uploaded September 2026 | Updated September 2026, 3 days ago
Watch how we transition from a conventional MEMS LGA package to a Wafer-Level Chip-Scale Package (WLCSP), also known as ASICap — featured in our BMA5 family.
💡 This packaging transition enables: 76% footprint reduction down to just 1.2 x 0.8 x 0.55 mm³, creating the world’s smallest MEMS accelerometers for space-critical, low-power wearables, hearables, and compact IoT devices
🔗 Discover more:
bosch-sensortec.com/products/motion-sensors/accelerometers
Watch how we transition from a conventional MEMS LGA package to a Wafer-Level Chip-Scale Package (WLCSP), also known as ASICap — featured in our BMA5 family.
💡 This packaging transition enables: 76% footprint reduction down to just 1.2 x 0.8 x 0.55 mm³, creating the world’s smallest MEMS accelerometers for space-critical, low-power wearables, hearables, and compact IoT devices
🔗 Discover more:
bosch-sensortec.com/products/motion-sensors/accelerometers
