Uploaded May 2026 | Updated September 2026, 2 weeks ago
As AI demands more "brain power" than ever before, the semiconductor industry is evolving, moving past the era of relying on single, massive chips.
Go inside Intel’s Fab 9 in New Mexico where many advanced packaging processes take place—the essential craft of connecting multiple specialized chips together. Using Foveros technology, these individual pieces function as a single, powerful unit that runs faster while handling massive workloads.
For example, Foveros helps laptop batteries last longer by placing power-hungry circuits on more power efficient process nodes. Laptops can become thinner, and edge computing devices can fit into smaller spaces without sacrificing performance. Foveros also allows for more features to be packed into a smaller footprint, from the factory floor to your desk.
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About Intel:
Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Founded in 1968 to build semiconductor memory products, Intel introduced the world's first microprocessor in 1971. This decade, our mission is to create and extend computing technology to connect and enrich the lives of every person on Earth.
Connect with Intel:
Visit Intel WEBSITE: intel.ly/Intel
Follow Intel on X: intel.ly/Twitter
Follow Intel on INSTAGRAM: intel.ly/Instagram
Follow Intel on LINKEDIN: intel.ly/LinkedIn
Follow Intel on TIKTOK: intel.ly/TikTok
Intel Foveros Technology: Inside Advanced Packaging in New Mexico | Intel
youtube.com/intel
As AI demands more "brain power" than ever before, the semiconductor industry is evolving, moving past the era of relying on single, massive chips.
Go inside Intel’s Fab 9 in New Mexico where many advanced packaging processes take place—the essential craft of connecting multiple specialized chips together. Using Foveros technology, these individual pieces function as a single, powerful unit that runs faster while handling massive workloads.
For example, Foveros helps laptop batteries last longer by placing power-hungry circuits on more power efficient process nodes. Laptops can become thinner, and edge computing devices can fit into smaller spaces without sacrificing performance. Foveros also allows for more features to be packed into a smaller footprint, from the factory floor to your desk.
Subscribe now to Intel on YouTube: intel.ly/3IX1bN2
About Intel:
Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Founded in 1968 to build semiconductor memory products, Intel introduced the world's first microprocessor in 1971. This decade, our mission is to create and extend computing technology to connect and enrich the lives of every person on Earth.
Connect with Intel:
Visit Intel WEBSITE: intel.ly/Intel
Follow Intel on X: intel.ly/Twitter
Follow Intel on INSTAGRAM: intel.ly/Instagram
Follow Intel on LINKEDIN: intel.ly/LinkedIn
Follow Intel on TIKTOK: intel.ly/TikTok
Intel Foveros Technology: Inside Advanced Packaging in New Mexico | Intel
youtube.com/intel
