How Nvidia and AI Are Forcing New Interconnect MSAs @AltiumAcademy
How Nvidia and AI Are Forcing New Interconnect MSAs  @AltiumAcademy
Uploaded May 2026 | Updated September 2026, 3 weeks ago
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From DesignCon to Embedded World to OFC, the industry is buzzing — and one name keeps coming up: Nvidia. In this clip from the Altium OnTrack Podcast, Samtec's Director of Technical Marketing Matt Burns breaks down what's really driving the surge in multi-source agreements (MSAs) and new interconnect architectures like CPX and XPO. With Nvidia as the 800-pound gorilla and competitors like Google's TPU and AMD's solutions pushing hard, the race to scale AI accelerators is reshaping how engineers think about copper and optical interconnects at every range.

Whether you're designing for AI data centers or just trying to keep pace with where the industry is heading, understanding the forces behind these interconnect standards is essential. The need to move massive AI model data — copper at short range, optics at long range — is no longer a niche concern. It's the central challenge of modern high-speed PCB and system design, and it's accelerating fast.

👉 Watch the full interview here: youtu.be/zuh6i-EAS_E

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How Nvidia and AI Are Forcing New Interconnect MSAs

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