Uploaded January 2026 | Updated September 2026, 2 weeks ago
On day 3 of HiPEAC 2026 in Krakow, Polan, Deming Chen, the Abel Bliss Professor at the University of Illinois Urbana-Champaign, presented the opening keynote entitled, “AI and Hardware Co-Design: Taming Quality, Productivity, and Reliability”.
In his talk, he advocated generating AI models and hardware accelerators as paired solutions, and the concept of co-design principles and how this should extend to LLMs, focusing on model structures, dataflow architectures, and compiler optimizations to achieve substantial latency and energy efficiency gains.
He also discussed how AI–HW co-design also addresses emerging challenges in reliability, with a flow that integrates LLMs, formal verification, and hardware synthesis to bridge natural language specifications and silicon implementations. Together,he said this can enable end-to-end AI–hardware co-design to provide a coherent and scalable framework for taming design quality, productivity, and reliability in next-generation AI systems.
EE Times caught up with Deming Chen after his talk to capture some of what he was aiming to convey in terms of co-design and co-search and why it is necessary.
Watch the video interview here.
----
Also:
🎙 Listen to EE Times On Air podcasts on power, embedded, AI, and more: eetimes.com/podcasts/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
🎥 Don't miss an episode and subscribe to our YouTube channel: youtube.com/@eetimes747
Stay up to date with the latest news in the electronics industry
➡️ EE Times: eetimes.com/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
➡️ Power Electronics News: powerelectronicsnews.com/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
➡️ Embedded: embedded.com/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
➡️ EDN: edn.com/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
📰 Subscribe to our newsletters: aspencore.dragonforms.com/loading.do?omedasite=EventSubscription&pk=youtube
🖥️ Attend free tech webinars: eetimes.com/webinars/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
📈 Download free industry white papers: eetimes.com/techpapers/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
🎤 Check out our virtual events on EE Times: events.eetimes.com/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
🎉 Interested in advertising opportunities? Reach out to sales@aspencore.com
On day 3 of HiPEAC 2026 in Krakow, Polan, Deming Chen, the Abel Bliss Professor at the University of Illinois Urbana-Champaign, presented the opening keynote entitled, “AI and Hardware Co-Design: Taming Quality, Productivity, and Reliability”.
In his talk, he advocated generating AI models and hardware accelerators as paired solutions, and the concept of co-design principles and how this should extend to LLMs, focusing on model structures, dataflow architectures, and compiler optimizations to achieve substantial latency and energy efficiency gains.
He also discussed how AI–HW co-design also addresses emerging challenges in reliability, with a flow that integrates LLMs, formal verification, and hardware synthesis to bridge natural language specifications and silicon implementations. Together,he said this can enable end-to-end AI–hardware co-design to provide a coherent and scalable framework for taming design quality, productivity, and reliability in next-generation AI systems.
EE Times caught up with Deming Chen after his talk to capture some of what he was aiming to convey in terms of co-design and co-search and why it is necessary.
Watch the video interview here.
----
Also:
🎙 Listen to EE Times On Air podcasts on power, embedded, AI, and more: eetimes.com/podcasts/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
🎥 Don't miss an episode and subscribe to our YouTube channel: youtube.com/@eetimes747
Stay up to date with the latest news in the electronics industry
➡️ EE Times: eetimes.com/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
➡️ Power Electronics News: powerelectronicsnews.com/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
➡️ Embedded: embedded.com/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
➡️ EDN: edn.com/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
📰 Subscribe to our newsletters: aspencore.dragonforms.com/loading.do?omedasite=EventSubscription&pk=youtube
🖥️ Attend free tech webinars: eetimes.com/webinars/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
📈 Download free industry white papers: eetimes.com/techpapers/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
🎤 Check out our virtual events on EE Times: events.eetimes.com/?utm_source=eetimes_youtube&utm_medium=social&utm_campaign=description
🎉 Interested in advertising opportunities? Reach out to sales@aspencore.com
