HC31-S7: Interconnects @hotchipsvideos
HC31-S7: Interconnects  @hotchipsvideos
Uploaded December 2019 | Updated September 2026, 3 weeks ago
Session 7, Hot Chips 31 (2019), Tuesday, August 20, 2019.

A Gen-Z Chipset for Exascale Fabrics
Patrick Knebel, HPE

TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth Optical I/O
Mark Wade, Ayar Labs
HC31-S7: InterconnectsHC2023-S6: InterconnectsHC25-S3: SoC 2HC30-S7: Machine Learning IHC25-S7: MobilityHC33-S6: ML and Computation PlatformsHC32-S6: Networking and Distributed SystemsHC2025-S5: OpticalHC2024-K2: The Journey to Life with AI PervasivenessHC25-K3: Intellectual Property Issues in the Computer and Electronics IndustriesHC2024-P: Poster Lightning TalksHC26-S6: High Performance ASICs
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HC31-S7: Interconnects

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