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Teledyne FLIR | Getting Started with Qualcomm RB5 and FLIR Hadron 640R | Thermal Integration Made Easy @Flir | Uploaded May 2023 | Updated October 2024, 4 hours ago.
In this video, Colin Hardy, Application Engineer, will show you how to set up the Hadron 640R development kit with the Qualcomm RB5 platform. This new plug-and-play solution is designed to help you quickly image and control the Hadron 640R (Dual Thermal and Visible OEM Camera Module) saving you potentially weeks in development time and cost. In most applications, these kits will help you get up and running within hours.

🔹HADRON 640R INTEGRATOR'S GUIDE
flir.com/products/Hadron-640R-Development-Kits

🔹FLIR CUST HELP
flir.custhelp.com

🔹 THERMAL INTEGRATION MADE EASY
flir.com/TIME

🔹ABOUT HADRON 640R DEV KITS
Hadron™ 640R development kits pair the performance-leading Hadron 640R with hardware and reference software drivers for quick integration with development boards supporting the Qualcomm RB5, the NVIDIA Jetson Nano, and the Qualcomm Snapdragon 865.

The development kits enable integrators to start imaging and controlling the infrared thermal and visible camera in hours, saving potentially weeks of development time and cost. Hadron 640R includes a 64 MP visible camera and a 640x512 resolution radiometric Boson® providing the ability to see through total darkness, smoke, most fog, and glare as well as take the temperature of every pixel in the scene.

With a size, weight, and power (SWaP) optimized design and the rapid development kits, the Hadron 640R is the ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and AI-ready applications where battery life and run-time are mission critical.

🔹 ABOUT TELEDYNE FLIR
Teledyne FLIR is the global leader in infrared camera innovation and manufacturing. Our midwave infrared (MWIR) and longwave infrared (LWIR) camera modules are designed for easy and efficient integration into higher-level assemblies and platforms. With industry-leading reliability, performance, and size, weight, and power (SWaP), they are ideal for OEM applications in defense, commercial, and security applications.

#teledyne #FLIR #qualcomm #qualcommRB5 #thermalimaging #LWIR #surveillance #drone #UAV #UAV #automotive #OEM #technology #techninnovation #AI #artificialintelligence
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Getting Started with Qualcomm RB5 and FLIR Hadron 640R | Thermal Integration Made Easy @Flir

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