Intel Technology | Foveros 3D Advanced Packaging Explained @IntelTechnology | Uploaded December 2023 | Updated October 2024, 2 hours ago.
Intel Core Ultra represents our biggest architectural shift in client processors in 40 years, and Foveros 3D advanced packaging is the foundation of Meteor Lake’s disaggregated design. In this clip Pat Stover, Senior Director of Technology Development, explains what makes Foveros different from other current 3D packaging solutions. Click the featured link in this video to learn more about how Meteor Lake is manufactured and packaged.
Intel Core Ultra represents our biggest architectural shift in client processors in 40 years, and Foveros 3D advanced packaging is the foundation of Meteor Lake’s disaggregated design. In this clip Pat Stover, Senior Director of Technology Development, explains what makes Foveros different from other current 3D packaging solutions. Click the featured link in this video to learn more about how Meteor Lake is manufactured and packaged.