Uploaded August 2024 | Updated September 2026, 9 hours ago
The Corning® Tropel® UltraSort™ II FlatMaster® Fully Automatic Wafer (FAW) is a fully automatic grazing incidence interferometer that provides fast and accurate metrology for semiconductor wafers up to 200mm in diameter. In seconds, over 1 million data points are collected with sub-micron accuracy enabling total thickness and flatness characterization over the entire surface. Also featured are the optional Bevel Profile and Defect (BPD) module and the Roughness (Ra) Module. The BPD module takes over 600 measurements of a wafer bevel in less than 20 seconds as well as identifies bevel defects down to a size of 5um. The Ra module is a white light interferometer used to measure the high-spatial frequency roughness of highly polish substrates. It can measure down to 1Å of roughness with accuracy within 2%. Take a look at how these analytics instruments provide robust metrology for a variety of applications.
The Corning® Tropel® UltraSort™ II FlatMaster® Fully Automatic Wafer (FAW) is a fully automatic grazing incidence interferometer that provides fast and accurate metrology for semiconductor wafers up to 200mm in diameter. In seconds, over 1 million data points are collected with sub-micron accuracy enabling total thickness and flatness characterization over the entire surface. Also featured are the optional Bevel Profile and Defect (BPD) module and the Roughness (Ra) Module. The BPD module takes over 600 measurements of a wafer bevel in less than 20 seconds as well as identifies bevel defects down to a size of 5um. The Ra module is a white light interferometer used to measure the high-spatial frequency roughness of highly polish substrates. It can measure down to 1Å of roughness with accuracy within 2%. Take a look at how these analytics instruments provide robust metrology for a variety of applications.
