Chinas Plan to Build 1.4nm Chips Without EUV @Octopart
Chinas Plan to Build 1.4nm Chips Without EUV  @Octopart
Uploaded June 2026 | Updated September 2026, 2 weeks ago
China may have just found a way around the most important machine in chipmaking — without ever touching it. The most advanced chips are printed with EUV lithography from ASML, and U.S. sanctions block China from buying those machines. In this one-minute Electronics Supply Chain Daily from Octopart, we break down Huawei’s answer: a new “Tau Scaling Law” and a LogicFolding architecture that stacks logic into two active layers using ultra-fine hybrid bonding instead of shrinking transistors.

Huawei claims roughly 238 million transistors per square millimeter today — a ~54% single-generation jump — and 1.4nm-class density by 2031, all without EUV, debuting in this fall’s Kirin phone chip. We also cover the skepticism: no independent verification yet, and stacking logic isn’t the same as a true node shrink, with heat and yield as major hurdles. If you follow the U.S.–China chip war, semiconductors, or advanced packaging, here’s the fast briefing.

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#Huawei #Semiconductors #ChinaChips
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China's Plan to Build 1.4nm Chips Without EUV

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