Uploaded August 2026 | Updated September 2026, 3 weeks ago
Huawei says it found a way around the EUV lithography machines it cannot legally buy, not by shrinking transistors, but by folding chips in 3D.
In this video, we break down Huawei’s Tau Scaling Law, also called LogicFolding, and explain how the company claims it can increase chip density without using ASML’s most advanced EUV lithography tools.
You’ll learn how Huawei uses hybrid bonding to stack active silicon layers, shorten signal paths, reduce RC delay, and increase transistor density on older process nodes that Chinese foundries can still manufacture domestically.
We also explain why the claimed density jump from the Kirin 9030 Pro to the upcoming Kirin 9050 matters, how this compares to TSMC and Intel node targets, and why investors reacted so strongly when Huawei revealed the technology in Shanghai.
This is not just a story about Huawei beating ASML. It is a story about semiconductor packaging, hybrid bonding, SMIC, EUV export controls, chip density, thermal limits, AI accelerators, Ascend chips, TSMC, Nvidia, and whether China can route around the most important machine in modern chipmaking.
#Huawei #ASML #Semiconductors #ChipTechnology #ChinaTechnology #EUV #SMIC #TSMC #LogicFolding #Kirin9050 #HybridBonding #AIChips #Nvidia #FutureTech #TechnologyNews
Huawei says it found a way around the EUV lithography machines it cannot legally buy, not by shrinking transistors, but by folding chips in 3D.
In this video, we break down Huawei’s Tau Scaling Law, also called LogicFolding, and explain how the company claims it can increase chip density without using ASML’s most advanced EUV lithography tools.
You’ll learn how Huawei uses hybrid bonding to stack active silicon layers, shorten signal paths, reduce RC delay, and increase transistor density on older process nodes that Chinese foundries can still manufacture domestically.
We also explain why the claimed density jump from the Kirin 9030 Pro to the upcoming Kirin 9050 matters, how this compares to TSMC and Intel node targets, and why investors reacted so strongly when Huawei revealed the technology in Shanghai.
This is not just a story about Huawei beating ASML. It is a story about semiconductor packaging, hybrid bonding, SMIC, EUV export controls, chip density, thermal limits, AI accelerators, Ascend chips, TSMC, Nvidia, and whether China can route around the most important machine in modern chipmaking.
#Huawei #ASML #Semiconductors #ChipTechnology #ChinaTechnology #EUV #SMIC #TSMC #LogicFolding #Kirin9050 #HybridBonding #AIChips #Nvidia #FutureTech #TechnologyNews
