XT-6 MatriX-FocalSpot 2013-08-20 | The XT-6 is a highly flexible x-ray inspection system featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis imaging in the smallest of space with the maximum speed and in high resolution
X3 In-Line Automated X-Ray Inspection (AXI) Inspection System MatriX-FocalSpot 2013-08-20 | The X3 is a production in-line automated x-ray inspection system for up to 100% inspection of solder joints on both single and double-sided printed circuit assemblies. Utilizing both transmission and off-axis imaging, the system can be setup flexibly depending on the SMT process to inspect Side A then Side B, or the Double-sided assembly. While transmission imaging offers the fastest and highest resolution imaging process, the X3 also uses two reconstruction techniques to address double sided assemblies and overlapping solder joints. These include the patent pending Slice Filter Technique and 3D-SART which allows inspection at multiple horizontal cross-sections or "slices". The X3 can identify Head-in-Pillow (HIP) defects, inspect Package on Package (POP) components and measure / check barrel fill on Thru Hole and Pin-In-Paste processes. The X-3 can also accommodate a front end Automated Optical Inspection Scanner to check for components presence/absence, polarity, off-position, tombstoning, and correct part.
Screening SMT Components for Counterfeit Component Indentification MatriX-FocalSpot 2013-08-20 | Matrix-FocalSpot utilizes advanced algorithms to automatically detect component differences in the Lead Frame Layout, Die Size/Shape, Paddle Size/Shape, and Wire Bond Layout including, Number & Position of Wire Terminations to identify counterfeit parts.
High Speed Reel to Reel Counterfeit Component X-Ray Inspection MatriX-FocalSpot 2013-08-20 | The Advanced Counterfeit Inspection System from Matrix-FocalSpot provides a high speed fully automated inspection system. The system can process components on Reel to Reel, Tubes and JEDEC trays. Advanced Screening Detection method using a Reference Image allows for screening the wire bond pattern, number of wires, lead frame pattern, die size/shape, and die paddle size/shape. All images are archived and can be traceable by serial number. A full report is automatically generated at the end of the inspection process.
01005 Rework Process MatriX-FocalSpot 2013-08-20 | The RD-500V is a advanced BGA/QFN Rework station capable of addressing the industry's smallest components as small as 01005 (0402 mm) to the heaviest thickest Probe Cards (.320 mils thick, 50 layer board, 50 layer parts).
XT-6 X-Ray Inspection System MatriX-FocalSpot 2013-08-20 | The XT-6 is highly flexible x-ray inspection system featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis x-ray imaging in the smallest of space with maximum speed and in high resolution. The XT-6 can be used manually, semi-automated (w/o CAD data), fully automated (w/ CAD data), 3D AXI with either Slice Filter Technology or 3D-SART, and in planar Computed Tomography Mode (pCT). The unit has options such as loader/unloader, off-line programming station, and Verification & SPC Stations. In depth Defect Detection allows for Head-in-Pillow (HIP) detection on BGA joints, Package-on-Package (POP), and Barrel Fill for Thru Hole or Pin-in-Paste processes.
