CERAMIC PACKAGE INTEGRATED CIRCUIT REVERSE ENGINEERING @electronupdate
CERAMIC PACKAGE INTEGRATED CIRCUIT REVERSE ENGINEERING @electronupdate
Uploaded May 2019 | Updated September 2026, 3 weeks ago
Removal of the lid of a ceramic integrated circuit and analysis of the die below. Part extracted from the CPU card of a DEC PDP 11/24 which dates to the early 1980's.
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CERAMIC PACKAGE INTEGRATED CIRCUIT REVERSE ENGINEERING

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